The only domestic EDA implementation case debuts at DAC! X-Inc and Lenovo jointly release AI Agent: library building efficiency improved by 50%

On July 26 local time, the world's largest Electronic Design Automation (EDA) industry event, DAC 2026, opened in Long Beach, California.

Chinese EDA company Xinhe Semiconductor, in collaboration with Lenovo Group, unveiled the latest research results of their EDA Agent strategic partnership, making it the only domestic EDA landing case at this year's conference.

It is understood that on November 19, 2025, Xinhe Semiconductor and Lenovo Group officially signed an EDA Agent strategic cooperation agreement. The on-site release at DAC 2026 marks the first public display of research results since the signing, indicating that the cooperation has moved from the strategic consensus stage to a verifiable and demonstrable actual output stage.

The core achievement of this release is the realization of a full-process AI design closed loop from PCB design to simulation verification.

In the design phase, the AI Agent runs through three key steps: library creation, layout, and design rule checking. In the simulation phase, the AI Agent assists in rapid iterative simulation of DDR and high-speed signals, automatic CCT channel checking, and optimization of high-speed link parameters.

This achievement has been validated in the design and simulation of Lenovo's AI PC motherboard PCB. In the design phase, the efficiency of automated library creation for schematic symbols and PCB footprints has been improved by over 50%. In the simulation phase, the number of iterations is effectively reduced, and the optimization simulation efficiency for full SERDES link optimization has been improved by over 80%.

Currently, most AI agent technologies from overseas EDA vendors are focused on the digital design side. In contrast, Xinhe Semiconductor's EDA Agent is positioned as a "multi-physics AI agent collaboration and Chip-to-System end-to-end autonomous optimization," directly serving next-generation intelligent products such as AI data centers and AI PCs.