Breaking news! Huawei's Kirin 2026 naming confirmed: Kirin 9050/Pro

According to blogger "RuryRen," the Kirin 2026 codename previously announced by Huawei has been confirmed with its final naming—Kirin 9050.

This includes two chips: the Kirin 9050 and Kirin 9050 Pro, which is consistent with Kirin's usual naming conventions.

This is the world's first mass-produced mobile chip featuring logic folding technology, adopting the Tau (τ) law evolution scheme. It upgrades the core logic circuits to a dual-layer vertical stacked architecture, replacing traditional "geometric scaling" with "temporal scaling," achieving a leap in performance and energy efficiency without relying on more advanced lithography processes.

According to Huawei's earlier introduction, the Kirin 2026 achieves a 53.5% increase in transistor density, reaching a new industry high of 238 million transistors per square millimeter.

This means 238 million transistors can be integrated per square millimeter of chip area, theoretically on par with Intel's 18A process and close to TSMC's first-generation 3nm.

At the same time, the chip's P-core energy efficiency has improved by 41%, and the maximum frequency has increased by 12.7%, achieving a dual leap in performance and energy efficiency.

Additionally, the Ark engine of HarmonyOS 7 debuts with a performance large model, boosting performance by 15%. Combined with the new Kirin chip, it will significantly enhance the performance of new devices.

Zheng Jun, CTO of Huawei Technologies' Financial Systems Division, previously revealed in a speech that the Tau law is a systematic and theoretical summary formed by Huawei over years in chips, processes, and engineering paradigms. It is not merely a theoretical law but has thoroughly transformed the rules of the chip manufacturing industry, reshaping the collaborative model and working methods of the chip supply chain.

Relying on the Tau (τ) law design paradigm, and with industrial chain collaboration and national independent technology support, Huawei has fully connected the entire process and supply chain of chip manufacturing, from upstream silicon element design to packaging and testing.

Chips developed based on the Tau law have been applied to the Huawei Mate90 model, achieving top-tier process standards close to 3nm.