Tao Dinglu chip + active fan! Huawei Mate 90 series Fengchi Edition performance skyrockets.

According to industry insider leaks, the Huawei Mate 90 series will have an earlier release this year, arriving before September.

According to tipster Smart Pikachu, the Mate 90 series will include a model featuring a Tao's Law chip and an active cooling fan. Based on previous generations, it is expected to be named the Fengchi Edition.

The Kirin 2026 is a mobile SoC built on Tao's Law and is expected to be named the Kirin 9050 Pro.

This is the world's first mass-produced mobile chip to adopt logic folding technology, upgrading the core logic circuit to a dual-layer vertical stacked architecture. It replaces traditional "geometry miniaturization" with "time miniaturization," achieving a leap in performance and energy efficiency without relying on more advanced lithography processes.

According to Huawei's previous introduction, the Kirin 2026 achieves a 53.5% increase in transistor density, reaching a new industry height of 238 million transistors per square millimeter. This means that per square millimeter of chip area, 238 million transistors can be integrated, theoretically on par with Intel's 18A process and close to the first-generation TSMC 3nm.

At the same time, the chip's P-core energy efficiency has improved by 41%, and the maximum frequency has increased by 12.7%, achieving a dual leap in performance and energy efficiency.

Previously, the Huawei Mate 80 Pro Max Fengchi Edition pioneered an industry-first hidden, imperceptible air outlet structure, creating over 1,200 laser-carved micro-holes in the rear camera module area. Inside the body, it features a bionic winged turbo fan paired with a super heat-conductive curved flow fin structure, significantly improving overall air intake and wind pressure performance.

The combination of an active cooling fan and Tao's Law will deliver Huawei's strongest performance in recent years, expected to handle mainstream mobile games effortlessly.