Huawei's new Kirin chip debuts logic folding technology: equivalent transistor density rivals TSMC's 3nm process.

According to blogger Dingjiao Digital, before applying logic folding technology, Huawei's Kirin chip had an equivalent transistor density roughly on par with TSMC's 5nm process. After introducing logic folding technology, its level can at least match TSMC's first-generation 3nm process, and may even be stronger.

It is reported that the Huawei Mate 90 series will feature the new Taoding Law Kirin chip, which is the first to adopt logic folding technology, marking an epic breakthrough in the domestic chip sector.

At the circuit level, logic folding technology breaks through the physical limits of traditional planar layouts, significantly shortening critical path routing lengths and effectively reducing resistance and capacitive loads during signal transmission, thereby greatly enhancing transistor density and circuit performance.

At the chip level, through a full-stack software-hardware-core collaborative design of "software, architecture, and chip," fine-grained control over instruction streams and data streams based on actual workloads significantly improves system-level parallelism and efficiency, greatly reducing end-to-end execution time.

According to Huawei's roadmap, by 2031, the transistor density of high-end chips based on the Taoding Law is expected to reach a level equivalent to the 1.4nm process. The implementation of the Taoding Law will comprehensively boost confidence in the domestic chip industry and benefit the coordinated development of the entire supply chain.

In the short term, it will directly drive the growth of upstream and downstream enterprises in domestic semiconductor materials, manufacturing, packaging, and testing; in the long term, Huawei's technical approach provides a new viable path for domestic chip design companies to avoid risks from advanced process restrictions and overcome technical bottlenecks.

The Huawei Mate 90 series, debuting with the Taoding Law Kirin chip, will officially launch in September. As the release date approaches, the chip's actual performance will become a focal point of industry attention.