Domestic semiconductor equipment leader AMEC sees half-year profit surge by 300%, with products already used in 3nm and below processes.

A domestic semiconductor equipment leader with a market value exceeding 350 billion yuan, AMEC, released its 2026 semi-annual report. In the first half of the year, it achieved operating revenue of 6.691 billion yuan, a year-on-year increase of 34.89%; net profit attributable to shareholders of the listed company reached 2.825 billion yuan, up 300.22% year-on-year.

After deducting non-recurring gains and losses, net profit attributable to the parent company was 1.123 billion yuan, an increase of 108.36% year-on-year.

AMEC also announced a new expansion plan. Its wholly-owned subsidiary, AMEC Lingang, plans to invest in the construction of the AMEC Lingang Industrialization Base (Phase II) project in the Lingang New Area, with a total planned investment of 3.5 billion yuan, including 1.7 billion yuan in fixed asset investment.

The project focuses on advantageous products such as etching equipment, metrology and inspection equipment, and thin-film deposition equipment. Once fully operational, it is expected to generate annual sales revenue of 3 billion yuan.

AMEC noted that shipments of its high-end products for key etching processes in advanced logic and memory device manufacturing have increased significantly, and multiple key etching processes in advanced logic devices and advanced memory devices have achieved large-scale mass production.

Specifically, in the logic integrated circuit manufacturing segment, the company's 12-inch high-end etching equipment has been deployed on the most advanced production lines of internationally renowned customers and is used in several critical steps in the processing of 3-nanometer and below devices.

Meanwhile, the company continues to develop equipment and optimize processes based on the needs of advanced integrated circuit manufacturers.

In the 3D NAND chip manufacturing segment, the company's plasma etching equipment has been applied in mass production of 128-layer and above devices. At the same time, the company is developing ultra-high aspect ratio etching equipment and processes based on the needs of memory device customers, and is also developing equipment for more advanced etching applications based on the needs of logic device customers.

The company's MOCVD equipment, Prismo A7 and Prismo UniMax, can achieve single-chamber processing capacities of 34 4-inch and 41 4-inch epitaxial wafers, respectively.

The Prismo A7 and Prismo UniMax equipment demonstrate outstanding technical capabilities and have secured a leading position in the global gallium nitride-based LED MOCVD market.

The company works closely with numerous first-tier LED epitaxial wafer manufacturers, achieving deep industrial integration.

The company's developed 12-inch low-pressure thin-film deposition equipment can be used for contact hole filling processes in advanced logic circuits, as well as meeting the process requirements of multiple steps in 128-layer and above 3D NAND. Additionally, the company is committed to developing contact hole filling equipment for more advanced logic circuits and equipment for contact hole and metal interconnect filling in memory devices with more layers, along with corresponding process validation.