Domestic semiconductor equipment is on the rise! AMEC's thin-film equipment shipments exceed 500 units: after etching, thin-film becomes the second growth driver.

Advanced thin-film equipment shipments have officially surpassed 500 reaction chambers, as announced by AMEC recently.

The product lineup includes multiple core models such as low-pressure chemical vapor deposition, metal thin-film deposition, and dielectric thin-film deposition, comprehensively covering mainstream thin-film deposition process requirements in semiconductor manufacturing, marking the completion of the company's large-scale commercial deployment of high-end thin-film deposition equipment.

Thin-film deposition is an indispensable core equipment category for advanced logic, memory, specialty devices, and advanced packaging. AMEC has built an advanced thin-film portfolio covering tungsten films, metal gates, and metal silicides, tailored to the stringent process requirements of advanced nodes.

In the tungsten metal deposition field, AMEC's self-developed CVD-W, HAR-W, and ALD-W support full-process tungsten deposition for memory, and have secured volume production orders from multiple key memory customers. They also support multiple tungsten interconnect steps in advanced logic and specialty devices, achieving full coverage across memory, logic, and specialty sectors.

For advanced logic, AMEC's Preforma Uniflash® metal gate series includes ALD titanium nitride, titanium aluminum, and tantalum nitride, which have completed validation at leading logic customers, with multiple metrics reaching world-class levels. The ALD titanium nitride is also adaptable to memory, specialty devices, and advanced packaging.

Addressing the pain points of high selectivity and low-resistance contact layers, AMEC has launched the Preforma Uniflash® metal silicide integrated system, suitable for logic source/drain, backside power delivery, and 3D memory contact layers, achieving high-quality microstructure filling and filling the domestic gap in high-end metal silicide equipment.

By the end of June 2026, AMEC had developed 54 types of high-end equipment, with over 8,800 reaction chambers in volume production across more than 220 production lines, achieving atomic-level precision in etching and thin-film processes. AMEC has maintained an average annual sales growth of over 35% for 14 consecutive years, with per-capita annual sales of approximately 4.5 million yuan, and its equipment covers over 30% of front-end integrated circuit equipment.

Looking ahead, AMEC plans to expand through independent development and external mergers and acquisitions, aiming to cover over 60% of high-end integrated circuit equipment and over 70% of the advanced packaging market within five years, advancing toward becoming a globally leading platform-type equipment company.