DDR5 memory hits 16000MT/s! Third-generation MRDIMM chipset officially released

Renesas Electronics announced the launch of its third-generation DDR5 MRDIMM chipset solution, boosting server-grade DDR5 MRDIMM transfer rates to 16000 MT/s, a 25% bandwidth improvement over the second-generation solution.

The new solution includes two core devices: the third-generation multiplexed registered clock driver (MRCD, model RRG5013) and multiplexed data buffer (MDB, model RRG5103), which will be showcased at FMS 2026 in Santa Clara, USA.

The MRDIMM architecture has been validated and matured in the second generation. The third generation expands performance while maintaining the original design, keeping standard DIMM form factors and system compatibility, allowing server platforms to achieve higher performance without disruptive architectural changes.

Renesas provides a full-link MRDIMM product portfolio, including MRCD, MDB, power management IC (PMIC), SPD Hub, and temperature sensors, allowing customers to scale MRDIMM performance across generations while maintaining design continuity.

The third generation also introduces system visualization and robustness enhancement features, including the Device Equalization Self-Training Mode (DESTM) quality indicator status, allowing users to fine-tune timing and receiver equalization training to maximize margin.

In terms of power consumption, Renesas stated that the Gen 3 solution is designed with system-level energy efficiency in mind, helping customers balance growing bandwidth demands with thermal and power constraints. Specific power consumption comparison data will be provided in product documentation. Renesas is currently working closely with major CPU and platform partners to promote the adoption of MRDIMM Gen 3 in future server platforms.

The MRCD (RRG5013x) and MDB (RRG5103x) are now sampling to select customers, including all major DRAM suppliers, with mass production expected in the second half of 2027.