500,000 units! RoboSense's self-developed SPAD-SoC chip deliveries break records: one LiDAR rolls off the line every 8 seconds.

RoboSense announced today that its self-developed SPAD-SoC chips have surpassed 500,000 units in cumulative deliveries, marking a leap from technical validation to mass production. This signifies that the company has achieved generation-leading production capacity and delivery capabilities in the core segment of digital LiDAR.

The SPAD-SoC is the core receiving and processing component of LiDAR. RoboSense's self-developed SPAD-SoC is the world's first chip to integrate a receiving array and SoC into a single unit for mass production, and it is also among the first to pass AEC-Q102 certification. RoboSense introduced the "Genesis" architecture, unveiling two series: "Phoenix" and "Peacock."

Both series have been ramping up production. The E2, the world's smallest all-solid-state digital LiDAR equipped with the "Peacock" chip, has entered mass production and delivery; deliveries of products featuring "Peacock" are expected to exceed 200,000 units in the second half of the year. The "Phoenix" chip is slated for its first automotive project SOP in Q4.

Behind the 500,000-unit delivery milestone is RoboSense's MARS intelligent manufacturing base. The facility boasts nearly 20 digital production lines, with 100% automation in core processes, producing one digital LiDAR every 8 seconds on average, with a planned annual capacity of 4 million units; 100% traceability in production and 98% coverage of automated inspection.

For quality control, MARS is equipped with fully automated calibration lines, with each unit undergoing aging, calibration, and full-system testing covering over 3,640 parameters; the company also operates a CNAS-accredited automotive laboratory, covering vehicle-grade validation from chips to complete units.

Leveraging its self-developed chips and algorithms, RoboSense is expanding into a new product category of spatial cameras, delivering millimeter-level RGB-D data. These have been integrated into capture systems for robot head-mounted and wrist-mounted applications, securing orders from global leading companies, with deliveries planned by the end of Q3 and mass production targeted for 2027.

RoboSense stated it will continue to refine its full-stack self-developed chip system, strengthen manufacturing and scale delivery capabilities, accelerate the productization of LiDAR, spatial cameras, and core robot components, and expand the application space for physical AI.