The US has backed down on its storage ban on China! The low-temperature etching clause has been quietly removed, and ChangXin says the impact is minimal.

According to reports, the U.S. "Multilateral Alignment of Hardware Technology Controls Act" (MATCH Act) has quietly removed a nationwide ban on low-temperature etching equipment targeting the Chinese market during its revision process.

The equipment, primarily supplied by U.S.-based Lam Research and Japan's Tokyo Electron, is a critical step in manufacturing 3D NAND flash memory and advanced DRAM. The move is widely interpreted as a compromise under lobbying pressure from equipment giants.

In response to this change, Chinese semiconductor companies such as ChangXin Memory Technologies (CXMT) remain composed. Chinese firms are downplaying the actual impact of U.S. export controls. This confidence stems from solid market data.

According to Omdia, CXMT's global DRAM market share surged from 4.7% in Q4 2025 to 7.6% in Q1 2026, ranking fourth globally. Revenue also hit a record high, reaching $8.6 billion in fiscal year 2025.

Apple's moves serve as another indicator. Public information shows that Apple is testing CXMT's DRAM chips across multiple product lines, including iPhones and MacBooks.

However, Apple reportedly attempted to压低 procurement prices but was flatly rejected by CXMT. CXMT insisted on pricing no lower than Samsung Electronics and SK Hynix, citing that domestic companies like Huawei and Xiaomi have already locked in its capacity through long-term contracts.

In the NAND flash sector, YMTC is also steadily advancing amid sanctions. Its 232-layer 3D NAND chips have achieved stable mass production, with some products matching international leaders in performance parameters.