MediaTek's most powerful 2nm chip! Dimensity 9600 Pro full specs revealed: GPU shares the same origin as Xiaomi's Xuanjie O3

MediaTek Dimensity 9600 Pro has appeared on the Geekbench benchmarking site, tested on the vivo X500 Pro Max. The chip scored 2,635 points in single-core and 7,516 points in multi-core on the engineering sample.
Since this benchmark is based on an early engineering unit, its actual performance has not been fully unleashed. Production units are expected to show significant improvements, with single-core scores projected to exceed 4,000 points and multi-core scores easily breaking the 10,000 mark.
The Geekbench listing fully reveals the key specifications of the Dimensity 9600 Pro. The chip features an 8-core design, with the CPU consisting of 2 super-large cores at 4.55GHz, 3 large cores at 4.35GHz, and 3 mid cores at 3.1GHz. Compared to the previous generation Dimensity 9500's maximum clock speed of 4.21GHz, the Dimensity 9600 Pro's super-large core frequency sets a new historical record for MediaTek, with more aggressive performance tuning.
On the GPU front, the Dimensity 9600 Pro integrates a brand-new G2 Ultra NX MC12 graphics processor, sharing the same architecture generation as the G2 Ultra NX used in Xiaomi's Xuanjie O3. The main difference lies in core configuration: the Dimensity 9600 Pro features a 12-core GPU, while the Xuanjie O3 is equipped with a more aggressive 16-core solution, pushing graphics performance stacking to greater extremes.
In terms of manufacturing process, the Dimensity 9600 Pro is built on TSMC's most advanced 2nm N2P process, making it MediaTek's first 2nm mobile chip. Compared to the initial N2 process, N2P offers a 5% to 10% performance boost and a 5% to 10% reduction in power consumption. Versus the N3E process, it delivers up to 18% higher performance, approximately 36% lower power consumption, and 1.2x greater logic density, showcasing outstanding energy efficiency advantages.
Notably, in addition to MediaTek, Qualcomm's upcoming sixth-generation Snapdragon 8 Elite and sixth-generation Snapdragon 8 Super Elite, set to debut in September, will also adopt TSMC's N2P process.
With these two flagship chips making their appearances, domestic flagship smartphones are officially entering the 2nm era. The comprehensive upgrade from chip to terminal also signals that the high-end smartphone market in the second half of 2026 is poised for intense head-to-head competition.
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